有很多其他称呼，包括FR-4光板，FR-4纤维板，FR-4环氧树脂板，FR-4阻燃绝缘板，这么多的称呼也从侧面反映了FR-4玻纤板广泛的应用。FR-4玻纤板一般用于软包基层，外面再包布艺、皮革等，做成美观的墙面、吊顶装饰。应用非常广泛。具有吸音，隔声，隔热，环保，阻燃等特点。下面是关于FR-4玻纤板具体的性能特点分析：FR-4环氧玻纤布，是以环氧树脂作粘合剂，以电子级玻璃纤维布作增强材料的一类基板。它的粘结片和内芯薄型覆铜板，是制作多层印制电路板的重要基材。
There are many other names, including FR-4 light sheet, FR-4 fiber sheet, FR-4 epoxy sheet, FR-4 flame retardant sheet, so many names also reflect the wide application of FR-4 fiberglass sheet from other side. . FR-4 fiberglass sheet is generally used for soft-packing base layer, and then wrapped with fabric, leather, etc., to make beautiful wall and ceiling decoration. The application is very extensive. With sound absorption, sound insulation, heat insulation, environmental protection, flame retardant and so on. The following is a detailed analysis of the performance characteristics of FR-4 glass fiberglass sheet: FR-4 epoxy fiberglass cloth, which is a kind of substrate with epoxy resin as binder and electronic grade glass fiber cloth as reinforcing material. Its bonding sheet and inner core thin copper clad plate are important substrates for making multilayer printed circuit boards.
性能：环氧玻纤布基板的机械性能、尺寸稳定性、抗冲击性、耐湿性能比纸基板高。它的电气性能优良，工作温度较高，本身性能受环境影响小。在加工工艺上，要比其他树脂的玻纤布基板具有很大的优越性。这类产品主要用于双面PCB ，用量很大。电绝缘性能稳定、平整度好、表面光滑、无凹坑、厚度公差标准，适合应用于高性能电子绝缘要求的产品，如FPC补强板、PCB钻孔垫板、玻纤介子、电位器碳膜印刷玻璃纤维板、精密游星齿轮(晶片研磨）、精密测试板材.气（电器）设备绝缘撑条隔板、绝缘垫板、变压器绝缘板、电机绝缘件、研磨齿轮、电子开关绝缘板等。
Performance: The mechanical properties, dimensional stability, impact resistance and moisture resistance of the epoxy fiberglass substrate are higher than those of the paper substrate. Its electrical performance is excellent, its operating temperature is high, and its performance is less affected by the environment. In terms of processing technology, it has great advantages over other resin fiberglass cloth substrates. These products are mainly used for double-sided PCBs and are used in large quantities. Stable electrical insulation performance, good flatness, smooth surface, no pits, thickness tolerance standards, suitable for high performance electronic insulation requirements, such as FPC reinforcement board, PCB drilling pad, glass fiber meson, potentiometer carbon Film printing fiberglass board, precision star gear (wafer grinding), precision test board, gas (electrical) equipment insulation struts, insulation pads, transformer insulation board, motor insulation parts, grinding gears, electronic switch insulation boards, etc.
FR-4环氧玻璃布层压板产品表面准备与处理
Surface preparation and treatment of FR-4 epoxy glass cloth laminate
1. 铜面经过图形和蚀刻形成电路之后，尽量要减少对PTFE表面的处理和接触。操作员应配戴干净手套并且在每片板子放隔层胶片以便传递到下一程序。
1. After the copper surface is patterned and etched to form a circuit, try to reduce the handling and contact of the PTFE surface. The operator should wear clean gloves and place a film on each board for transfer to the next procedure.
2. 经蚀刻过后的PTFE表面具备足够粗糙度进行粘合。在蚀刻过薄片的地方或者未覆盖层压板将被粘合的地方，建议对PTFE表面进行处理以提供足够的依附。在pth准备过程中所使用的化学成分也能用于表面处理。推荐等离子蚀刻或含钠的化学试剂。
2. The etched PTFE surface has sufficient roughness for bonding. Where the lamella is etched or where the laminate is not covered, it is recommended that the PTFE surface be treated to provide adequate attachment. The chemical components used in the pth preparation process can also be used for surface treatment. Plasma etching or sodium containing chemicals are recommended.
3. 铜表面处理应保证最佳粘合强度。棕色的一氧化铜电路处理将加强表面形状以便于使用TacBond粘合剂进行化学粘合。第一个过程要求一名清洁员去除残余和处理用油。 接下来进行细微的铜蚀刻以形成一个统一的粗糙表面区域。棕色的氧化物针状晶体在层压过程中稳固了粘合层。同任何化学过程一样，每一步进程后的充分清洗都是必需的。盐残余会抑制粘合。最后的冲洗应实行监督并保持PH值小于8.5。逐层干燥并确保表面不被手上的油之类的污染。
3. Copper surface treatment should ensure optimum bond strength. The brown copper oxide circuit treatment will reinforce the surface shape for chemical bonding using TacBond adhesive. The first process requires a cleaner to remove residual and processing oil. A fine copper etch is then performed to form a uniform rough surface area. The brown oxide needle crystals stabilize the adhesive layer during lamination. As with any chemical process, adequate cleaning after each step is required. Salt residue will inhibit adhesion. The final rinse should be supervised and maintained at a pH of less than 8.5. Dry layer by layer and ensure that the surface is not contaminated by oil on your hands.
叠加与层压
Overlay and lamination
推荐粘合（压合或压板）温度：425℉（220℃）
Recommended bonding (press or plate) temperature: 425 ° F (220 ° C)
1. 250oF(100℃)烘烤板层以消除水分。板层储存在紧密控制的环境中并在24小时之内使用。
1. Bake the plate at 250oF (100 ° C) to remove moisture. The plies are stored in a tightly controlled environment and used within 24 hours.
2. 工具板与第一个电解板之间应使用压力场以使得控制板中的压力能平均分配。存在于板中以及将被填充的电路板中的高压区域将被场吸收。场也能使从外部到中心的温度统一起来。从而形成控制板与控制板之间的厚度统一。
2. A pressure field should be used between the tool plate and the first plate to distribute the pressure in the control panel evenly. The high voltage regions present in the board and in the board to be filled will be absorbed by the field. The field also unifies the temperature from the outside to the center. Thereby forming a uniform thickness between the control board and the control board.
3. 板必须由供应商提供的TAC BOND薄层组成。在切割薄层与叠加的时候要小心防止污染。根据电路设计及填充要求，1至3张粘合薄层是必需的。需要填充的区域以及介电要求都被用于计算0.0015"(38微米)薄板的需求。推荐在层压板之间使用干净精钢制或铝制镜板。
3. The board must consist of a thin layer of TAC BOND supplied by the supplier. Be careful to prevent contamination when cutting thin layers and stacking. Depending on the circuit design and filling requirements, 1 to 3 bonded layers are required. The areas that need to be filled and the dielectric requirements are used to calculate the 0.0015" (38 micron) sheet. It is recommended to use clean steel or aluminum mirror plates between the laminates.
4. 为协助层压，在加热前进行20分钟的真空处理。整个周期都保持真空状态。抽离空气将有助于确保完成电路的封装。
4. To assist in lamination, vacuum treatment is carried out for 20 minutes before heating. The vacuum is maintained throughout the cycle. Pumping away from the air will help ensure that the circuit is packaged.
5.在中心板的外围区域放置热电偶就能确定温度监测与适当的周期。
5. Place a thermocouple in the peripheral area of the center plate to determine temperature monitoring and appropriate cycles.
6. 板可装入冷的或已预热的压机压盘上启动。如果不用压力场进行补偿，热力上升和循环将会不同。向包装中输入热量并不是关键的，但应尽量控制以减少外围与中心区域之间的差距。通常，热率在12-20oF/min(6-9℃/min)到425oF(220℃)之间。
6. The plate can be loaded onto a cold or preheated press platen. If the pressure field is not used for compensation, the heat rise and cycle will be different. It is not critical to enter heat into the package, but it should be controlled to minimize the gap between the perimeter and the center. Typically, the heat rate is between 12-20oF/min (6-9 °C/min) and 425oF (220 °C).
7. 一旦装入压机中，压力就能立即应用。压力也将随控制板的大小不同而不同。应控制在100-200psi(7-14bar)的范围之内。
7. Once loaded into the press, the pressure can be applied immediately. The pressure will also vary with the size of the control board. It should be controlled within the range of 100-200 psi (7-14 bar).
8. 保持热压高温在425oF(230℃)至少15分钟。 温度不得超过450oF(235℃).
8. Maintain hot pressing at 425oF (230°C) for at least 15 minutes. The temperature must not exceed 450oF (235°C).
9. 在层压过程中，尽量减少无压状态的时间（如从热压机转移到冷压机的时间）。保持压力状态压力直到低于200oF(100℃)。
9. During the lamination process, minimize the time of no pressure (such as the time from the hot press to the cold press). Maintain pressure in the pressure state until it is below 200oF (100°C).
